Custom Tutorials

• CMC develops customized client specific tutorials
• Provides training for research, development and engineering staff
• Focus on advanced materials and assembly processes used in electronic industry
• Recent tutorial topics:
  - Electroless and electrolytic plating for electronic   packaging applications
  - Laser drilling
  - Thin film metallization
  - Thick film hybrid circuit metallization
  - Failure analysis tools and techniques
  - RF and microwave packaging technology
  - Wire-bond and flip chip interconnect technology

Recent CMC Papers and Presentations

1. Carrasco, G., Harris, Jonathan, Rubel, Erich, CMC Laboratories, Inc. and Beckett, T., Tom Beckett Electrochemical Plating Consulting.  "Smart Rack Plating Technology Development", Metal Finishing July/August 2010.


2. Harris, Jonathan- President, CMC Laboratories, Inc. and Matthews, Michael- President, Ormet Circuits, Inc. "Selecting Die Attach Technology for High-Power Applications." Power Electronics Technology January 11, 2009.


3. Harris, Jonathan H. and Rubel, Erich, CMC Laboratories, Inc. "The Role of Interfacial Compound Formation on Package Reliability" IMAPS Advanced Materials July 2008: 20.


4. Tutorial: Semiconductor Wafer Backside Metallization: Die Attach for High Thermal Demand Applications. Instructor, Jonathan H. Harris. April 2007. IEEE Components, Packaging, and Manufacturing Technology Society-Phoenix Chapter.


5. Harris, Jonathan and Rubel, Erich, CMC Laboratories. “Tough Thermal Apps Drive AuSn Die Attach." Semiconductor International. October 1, 2007.


6. Harris, Jonathan H. and Leonardi, Nicholas, CMC Laboratories (2006, July). The Global Electronic Packaging Roadmap: The Drive to Lower Cost [PowerPoint slides]. Paper presented at the annual conference of Semicon West, San Francisco, CA.


7. Tutorial: How Interfacial Structure Can Play a Key Role in Package Reliability [PowerPoint slides]. Insructors; Harris, Jonathan; Rubel, Erich; and Olivar, Rutilio, CMC Laboratories (2006, September). IEEE Components, Packaging, and Manufacturing Technology Society. Phoenix Chapter. Failure Analyses for Electronic Packaging Tutorial Meeting.


8. Harris, Jonathan H.; Enck, Rudy; Leonardi, Nick; and Rubel, Erich, CMC Laboratories (2005, May). Material and Interfacial Impact on Package Thermal Performance [PowerPoint slides]. Paper presented at MEPTEC Thermal Conference.