CMC provides technical consulting services focused on solving materials related problems in electronic packaging applications.  This includes in-depth root cause analysis on failed samples and collaboration with customers on process changes, design issues or material choice to address problems. 

Examples of the types of issues CMC addresses include:  low wirebond strength, die attach lifts, solder microstructure and reliability issues, metallization failures, ceramic cracking, die cracking, plated layer blistering or delamination, and hermeticity failures.

CMC is uniquely positioned to address these types of problems because of a diverse collection of core strengths that includes:

• Analytical Group

• Materials Science focus

• Packaging materials processing know-how

• Volume manufacturing experience

• Testing and Reliability Evaluation Group

• Thermal Characterization and broad experience in thermal management

CMC provides this type of support in a wide-range of packaging applications and industries.  CMC's industrial experience includes:

• High brightness LEDs

• Medical Devices

• Power Semiconductors and Modules

• RF and Microwave

• Telecommunications Laser Diodes

• Consumer Electronics

• HCPV

• MEMs

• Electronic Materials

• Ceramics

CMC also provides technical market and applications evaluation services for clients.  This involves assisting client's to identify new product opportunities and potential customers in advanced packaging and assembly applications.  This service also includes quantifying the size of market opportunities, making introductions to potential customers, evaluating  competitive technologies and barrier to market entry.  CMC has provided this type of specialized service to a number of advanced materials companies interested in entering applications where CMC has expertise and industry connections.