News & Events
Latest News
* CMC announces the development of a breakthrough new electroplating technology which greatly narrows plating thickness distribution width. This technology is ideally suited for precious metal plating where narrower distributions translate to significant plating cost savings. This technology was featured in a recent technical article in the July/August issue of Metal Finishing Magazine. Click to view the entire article; "Smart Rack Plating Technology Development", by G. Carrasco, Dr. J. Harris, T. Beckett, and E. Rubel, CMC Laboratories, Tempe, Arizona.
* CMC Laboratories is excited to announce that it has significantly expanded its Analytical Service capabilities through collaboration with a local Failure Analysis Lab. CMC now offers a more complete array of surface spectroscopy techniques. These new services include: Focused Ion Beam (FIB), Secondary Ion Mass Spectrometry (SIMS), and Auger Electron Spectroscopy (AES).
* Harris, Jonathan - President, CMC Laboratories, Inc. and Matthews, Michael - President, Ormet Circuits, Inc. "Selecting Die Attach Technology for High-Power Applications." Power Electronics Technology January 11, 2009.
* CMC Laboratories has expanded its microscopy capabilities with a real time X-ray system. In conjunction with our X-ray film photography, CMC's ability to non-destructively analyze components in five degrees of freedom allows for a more detailed evaluation.
FEIN FOCUS features:
- 2600x magnification
- Computerized digital image processing
- Live video capture
- Five axis capability
Events
October 17-21, 2010: ASM/ Materials Science & Technology in Houston, Texas
October 26-27, 2010: SMTA International Electronics Exhibit in Orlado, Florida
October 31- Nov. 4, 2010: IMAPS 43rd Annual Symposium on Microelectronics in Raleigh, North Carolina
