CMC’s focus on semiconductor devices includes micron-level analysis of device structure and failure signatures. CMC has significant experience with power semiconductor devices and with LEDs. CMC also provides competitive analysis for a wide range of semiconductor devices, which consists of in-depth tear downs, including basic device structure as well as packaging and encapsulation.
In the medical area, CMC has significant experience in construction analysis of passive components used in implantable devices to determine potential failure modes. This type of analysis involves in-depth microstructural characterization of materials and interfaces used in critical components, with an assessment of potential defects and projected associated failure modes.
CMC has extensive experience in failure analysis, reliability evaluation and materials development in LED applications. This includes high power LED packaging (ceramic based), mid-power LED packaging (lead-frame based), and LED assembly technologies including die attach, wirebonding, encapsulation and molding. Working with major LED device manufacturers, CMC has been closely involved in the evolution of LED packaging solutions over the past decade.
CMC has experience in a range of automotive applications, including: automotive LED lighting, hybrid circuits for automotive motor control, and automotive sensors with control circuits. CMC has direct experience with the specific and rigorous reliability requirements in the auto industry. In addition to standard failure analysis tests, CMC has developed specialized automotive focused characterization.
CMC’s experience base in Mil-Aero applications includes failure mode identification and proposals for failure mode mitigation, predominantly in space applications. CMC works closely with customer laboratories, government agencies and defense contractors. CMC’s role includes failure analysis aimed at root cause determination and physics of failure modeling to help customer’s teams quantify and address potential reliability issues.