Licensing & Technology Transfer
CMC offers a wide range of technology developed in-house or in collaboration with technology partners for license. CMC provides licensees with all of the processing and equipment details to be successful in a manufacturing environment. This includes specifications for raw materials, qualified vendors lists, equipment specifications, detailed operating procedures, quality checkpoints and testing requirements. CMC has experience successfully transferring technology worldwide.
Aluminum Nitride Co-fired Packages
- Technology for license and technology transfer
- Thermal conductivity of 170 or 190 W/m-K minimum
- Tungsten internal metallization
- Up to 20 metal layers
- Cavity formation technology
- Thick film or thin film external layer metallization
- Includes plating and brazing technology
Ultra-High Thermal Conductivity AlN Substrates
- AlN substrates
- Standard thermal conductivity of 190 W/m-K in production
- Ultra-high thermal conductivity of 240 W/m-K in production
- Thermal conductivities of 260 W/m-K demonstrated
- Ideal for laser diode sub-mount and other ultra-high thermal demand applications
Direct Bond Copper
- DBC thick copper metallization on alumina and AlN
Aluminum Nitride Metallization
- Thin film metallization
- Cu, Ni, Ni-Co and Au plated layers
- Tungsten based thick film


